Tiny solder-down module with NXP’s i.MX93 processor
27mm SoM offers low-power 64-bit solution for intelligent edge processing
QS93 is a 27mm x 27mm QFN Style solder-down system-on-module with NXP’s dual-core i.MX935 with ARM Cortex-A55 processors, plus RAM, Flash memory and power management, integrated on a QFN-footprint PCB with excellent EMC, thermal and cost optimisations. The module is square, with a height of 2.7mm, and requires a single 3.3v supply. A full industrial operating temperature range of -40C to +85C is supported.
The QS93 module’s i.MX935 processor provides a dual 1.7GHz ARM Cortex-A55 core as well as a separate ARM Cortex-M33 running at 250MHz. There 1GB of of LPDDR4 RAM, 4GB eMMC Flash, and a wide range of interfaces including dual USB and dual Ethernet. The i.MX935 also includes an Arm® Ethos™ U-65 microNPU which affords energy-efficient implementation of machine learning (ML) tasks.
As well as energy-efficient operation, the i.MX93 processor offers powerful multimedia capability, with MIPI-CSI camera, a 2D GPU and LVDS display support. Optimal security features are provided by NXP’s Edgelock Secure Enclave.
QS93 comes with a dedicated development system, equipped with Linux BSP.
Development kits are now in stock – simply follow the “Buy Online” link below.



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